Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
A National Academies roundtable to discuss issues of research and engineering relevant to the mission of the Basic Research Office of the Department of Defense. The National Academy of Engineering, in ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results